Method of handling semiconductor wafers, bars and chips

Details Method of handling semiconductor wafers, bars and chips Method of handling semiconductor wafers, bars and chips

1997-11-14

1999-05-04

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438460, 438465, H01L 21301

Patent

active

058997300

ABSTRACT:
The invention is a method for handling material which may be in the form of semiconductor wafers, bars, and/or chips. The material is mounted to a flexible film which is heated so as to result in an adhesion strength sufficient to hold the material in place, but low enough so that the material can be removed easily when desired.

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