Method of handling electronic component chips

Details Method of handling electronic component chips Method of handling electronic component chips

1995-04-17

1997-04-22

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156237, 156344, 118423, 118428, 118500, B05C 300, B05C 1300

Patent

active

056225857

ABSTRACT:
In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to from external electrodes thereon.

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Co-pending U.S. Patent Application No. 08/339,480.
English Language Translation of Japanese 62-140720.
English Language Translation of Japanese 5-74665.

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