Method of fusing and programming fuse frame

Electric heating – Inductive heating – Metal working

Patent

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Details

219605, 219636, 29847, 437170, H05B 602, H01L 23495

Patent

active

057477795

ABSTRACT:
A method of fusing and programming a fuse frame for use in a semiconductor package is disclosed. A fuse frame includes an external lead arranged for electrically connecting to a first internal element of the semiconductor package and to extend externally from the semiconductor package and an internal lead arranged to be positioned entirely within the semiconductor package is also provided for electrically connecting a second internal element of the semiconductor package to a third internal element of the semiconductor package. A fuse bar supportably connects the internal lead to the external lead. The fuse bar includes a conductive material which fuses when excess current runs through it. A semiconductor package is made of a fuse frame and a die is mounted on the fuse frame such that the die supports the internal lead of the fuse frame. A programmable fuse frame is disclosed. A programmable fuse frame includes a matrix of fuse bars and lead bars. The fuse bars may be selectively fused to define one or more isolated conductive paths through the programmable fuse frame.

REFERENCES:
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patent: 4587548 (1986-05-01), Grabbe et al.
patent: 4983804 (1991-01-01), Chan et al.
patent: 5014420 (1991-05-01), Howard et al.
patent: 5110754 (1992-05-01), Lowrey et al.
patent: 5357084 (1994-10-01), McKee et al.

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