Method of forming wirings for tile-shaped elements,...

Details Method of forming wirings for tile-shaped elements,... Method of forming wirings for tile-shaped elements,...

2006-12-19

2006-12-19

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S040000, C257S746000, C257SE23078

Reexamination Certificate

active

07151313

ABSTRACT:
Methods are provided to form wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment, with which highly reliable electrical wirings having minute wiring patterns can be formed. In wiring forming method for a tile-shaped element, which is used, when a circuit device is formed by connecting a tile-shaped element having at least an electrode and a tile configuration to a final substrate having at least an electrode, to form an electrical wiring that electrically connects the electrode of the tile-shaped element to the electrode of the final substrate, liquid material including electro conductive material is applied to at least a part of a wiring region that is a region where the electrical wiring is formed on at least one of surfaces of the final substrate and the tile-shaped element.

REFERENCES:
patent: 4585548 (1986-04-01), Cadzow et al.
patent: 2001/0036718 (2001-11-01), Williams
patent: 2002/0028527 (2002-03-01), Maeda et al.
patent: 2005/0145839 (2005-07-01), Yamamoto et al.
patent: 2000-058562 (2000-02-01), None
patent: A 2003-197881 (2003-07-01), None
patent: A 2003-204047 (2003-07-01), None
patent: A 2003-347672 (2003-12-01), None
patent: A 2004-014913 (2004-01-01), None
patent: A 2004-021034 (2004-01-01), None
patent: A 2004-022901 (2004-01-01), None
patent: A 2004-023058 (2004-01-01), None
patent: A 2004-126152 (2004-04-01), None
patent: A 2004-172965 (2004-06-01), None
patent: A 2004-191390 (2004-07-01), None
patent: A 2004-191391 (2004-07-01), None
patent: A 2004-191392 (2004-07-01), None
patent: PCT/JP03/01290 (2006-08-01), None

Affiliated with

Also associated with

Rating

Method of forming wirings for tile-shaped elements,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming wirings for tile-shaped elements,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming wirings for tile-shaped elements,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3684527