Method of forming wirings

Details Method of forming wirings Method of forming wirings

1992-05-29

1993-12-21

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437194, H01L 2144

Patent

active

052721108

ABSTRACT:
A method of forming wirings which comprises depositing an Al or Al alloy wiring material to a predetermined thickness on a semiconductor substrate having a stepped dent such as a connection hole thereby filling and flattening the dent, then etching back the Al or Al alloy film to leave a portion to a predetermined thickness in the direction of the thickness, and a stop of patterning the thus left Al or Al alloy wiring material in desired wiring shape. Filling and flattening for the dent of the semiconductor substrate can be attained without causing trouble for the subsequent flattening of the inter-layer film, while preventing the reduction of the Al grain size of the Al or Al alloy film and preventing reduction of the electromigration resistance.

REFERENCES:
patent: 4884123 (1989-11-01), Dixit et al.
patent: 4977105 (1990-12-01), Okamoto et al.
patent: 5081064 (1992-01-01), Inoue et al.
patent: 5106781 (1992-04-01), Penning De Vries
patent: 5124780 (1992-06-01), Sandhu et al.
S. Wolf, Silicon Processing for the VLSI Era, vol. 2, Lattice Press, Sunset Beach, 1990, pp. 189-191, 254-255.

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