Method of forming wire reinforced corrugated board

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156206, 156210, 156266, 156456, 156470, B31F 124

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active

042037905

ABSTRACT:
Wire reinforced paper products wherein wires are affixed to a paper layer or included within a paper structure with at least one paper layer conforming to the contour of the wires to supplement the rigidity produced by the wires and a corrugated paper structure including wires disposed therein. The paper products are manufactured in continuous processes which enable the use of one or two sets of parallel wires, the latter producing a wire grid structure. In the manufacture of corrugated structures one or two sets of wires may be included in the corrugated portion and the overlying layer or layers and in so doing the structural strength and moisture resistant characteristics of the resultant corrugated board may be increased several fold without materially increasing the cost of the board as compared with board using relatively heavy paper in order to achieve increased strength.

REFERENCES:
patent: 958450 (1910-05-01), Wardell
patent: 2290386 (1942-07-01), Schindler
patent: 2763586 (1956-09-01), Noyes
patent: 3188813 (1965-06-01), Foster et al.
patent: 3250655 (1966-05-01), Adler
patent: 3364094 (1968-01-01), Rosler
patent: 3508992 (1970-04-01), Chavonnes
patent: 3562083 (1968-02-01), Schroder
patent: 3578544 (1971-05-01), Thorsrud
patent: 3591434 (1971-07-01), Hartstein
patent: 3674620 (1972-07-01), McCarthy et al.
patent: 3679537 (1972-07-01), Huer et al.
patent: 3687764 (1972-08-01), Rogosch et al.
patent: 3709764 (1973-01-01), Thomas
patent: 3811987 (1974-05-01), Wilkinson et al.
patent: 3886019 (1975-05-01), Wilkinson et al.

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