Method of forming vias

Details Method of forming vias Method of forming vias

1995-12-18

1997-11-04

Padgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427 97, 427 99, 427124, 427125, 4273762, 427531, 20419217, 216 17, 216 65, 21912171, B05D 512, B05D 302, C23C 1400, B23K 2600

Patent

active

056837585

ABSTRACT:
A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.

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