Metal working – Method of mechanical manufacture – Electrical device making
Patent
1983-02-28
1985-10-01
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
174 685, 427 97, H01K 310
Patent
active
045437157
ABSTRACT:
A multilayer printed circuit board (10) is provided with vertical circuit traces (51-54) which are readily accessible by mechanical means, by first creating vias at the locations of the vertical circuit traces (51-54). An opening (59) is then bored in a manner that the perimeter of the opening (59) intercepts the vias. The remaining plating material on the vias forms the vertical circuit traces (51-54), which are thereby established along the perimeter of the opening (59).
This technique utilizes procedures which are readily adaptable to present multilayer printed circuit board manufacturing techniques and which effect a low cost and reliable connection. Furthermore, the vertical circuit traces (51-54) are readily accessible for mechanical broaching and can be formed in a relatively high-density configuration.
REFERENCES:
patent: 3742597 (1973-07-01), Davis
patent: 3760091 (1973-09-01), Cannizzaro et al.
patent: 3930963 (1976-01-01), Polichette et al.
patent: 4104111 (1978-08-01), Mack
patent: 4372046 (1983-02-01), Suzuki
IBM Tech. Discl. Bulletin, vol. 10, No. 12, May 1968, pp. 1985, 1986, Making Interconnections in Multilayer Boards.
Iadarola Ralph E.
Russo Gene W.
Strassle Warren F.
Allied Corporation
Arbes Carl J.
Goldberg Howard N.
Protigal Stanley N.
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