Method of forming tungsten carbide by chemical vapor deposition

Coating processes – Coating by vapor – gas – or smoke – Carbon or carbide coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4272552, 423440, C23C 1632

Patent

active

049802011

ABSTRACT:
The invention relates to a chemical vapor deposition (CVD) method for forming tungsten carbide, W.sub.3 C, by subjecting a gas mixture of tungsten hexafluoride, hydrogen and an aromatic hydrocarbon, e.g. benzene, to vapor phase reaction at an elevated temperature. The reaction temperature can be lowered to the extent of 250.degree. C. and the reaction can be carried out even at normal pressure, not necessarily under reduced pressure, by proportioning tungsten hexafluoride, hydrogen and the hydrocarbon such that in the gas mixture the atomic ratio of C to W falls in the range from 2 to 10 while the atomic ratio of H to C is not lower than 3. By this method a W.sub.3 C film excellent in glossiness can be deposited on various metal parts without adversely affecting the metal parts by the elevated temperature.

REFERENCES:
patent: Re30626 (1981-05-01), Kaplan et al.
patent: 3368914 (1968-02-01), Darnell et al.
patent: 3369920 (1968-02-01), Bourdeau et al.
patent: 3389977 (1968-06-01), Tarver
patent: 3574672 (1971-04-01), Tarver
patent: 3814625 (1974-06-01), Lewin et al.
patent: 3848062 (1974-11-01), Steiger et al.
patent: 4874642 (1989-10-01), Garg et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming tungsten carbide by chemical vapor deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming tungsten carbide by chemical vapor deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming tungsten carbide by chemical vapor deposition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1161793

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.