Method of forming trench isolation

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Reexamination Certificate

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C438S692000, C438S753000

Reexamination Certificate

active

07811897

ABSTRACT:
A wet etching method of removing silicon from a substrate includes depositing a layer comprising silicon in elemental form over a substrate. The layer is exposed to an aqueous liquid etching solution comprising a hydroxide and a fluoride, and having a pH of at least 10, under conditions and for a period of time effective to etch the elemental silicon from the substrate. Wet etching can be employed in methods of forming trench isolation, and in other methods. Other aspects and implementations are contemplated.

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patent: 7135381 (2006-11-01), Fucsko et al.
Bertagna et al.,Ionic components dependence of the charge transfer reactions at the silicon / HF solution interface, 4 J. Solid State Electrochem. 42-51 (1999).

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