Method of forming transparent conductor pattern

Details Method of forming transparent conductor pattern Method of forming transparent conductor pattern

1979-10-01

1981-07-07

Hoffman, James R.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 82, 427 99, 427108, 427109, 427110, B05D 512, B05D 310, B05D 136

Patent

active

042775175

ABSTRACT:
A continuous layer of transparent material is formed on a base. A desired pattern of transparent electrically conductive material is included in the layer. The regions of the layer not included in the conductor pattern are insulative. The insulative material is preferably an indium oxide. Tin is preferably used as a dopant in the indium oxide to make it electrically conductive according to the desired pattern. The electrically conductive pattern is first formed in metallic tin. The tin pattern is diffused into a layer of metallic indium. The layer is then thermally oxidized to form the electrically conductive pattern as indium-tin-oxide (ITO) in indium sesquioxide, In.sub.2 O.sub.3, an insulator.

REFERENCES:
patent: 2932590 (1960-04-01), Barrett et al.
patent: 2971867 (1961-02-01), Lytle
patent: 3455722 (1969-07-01), Kushihashi
patent: 3814501 (1974-06-01), Schindler
patent: 3944684 (1976-03-01), Kane et al.
patent: 3957029 (1976-05-01), Nozik et al.
patent: 4010291 (1977-03-01), Katsube et al.
patent: 4025944 (1977-05-01), Moon
patent: 4048372 (1977-09-01), Ando et al.
Sekl et al., IBM Technical Disclosure Bulletin, vol. 6, No. 5, Oct. 1963, p. 68.

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