Method of forming transparent and conductive ultrathin films

Details Method of forming transparent and conductive ultrathin films Method of forming transparent and conductive ultrathin films

1996-02-29

1998-09-08

King, Roy V.

Coating processes

Direct application of electrical, magnetic, wave, or...

Ion plating or implantation

427109, 427166, 4271261, 4271262, 427249, B05D 306, B05D 506

Patent

active

058042555

ABSTRACT:
The invention provides a method of producing tranparent and conductive ultrathin films of metal carbide or metal nitride on a glass, ceramics or organic polymer substrate, which comprises the steps of exciting a surface of said substrate by irradiating said surface with a carbon or nitrogen ion beam; simultaneously vapor-depositing a transition metal onto said surface to form a carbide or nitride layer; and terminating the excitation and the vapor-deposition when the thickness of the metal carbide or nitride layer is in the range of 1 nm to 50 nm, and the light permeability of the metal carbide or nitride layer is in the range of 30% to 90%, wherein the conductivity of the metal carbide or nitride layer is in the range of 1 k.OMEGA./.quadrature. To 100 k.OMEGA./.quadrature..

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Pierson, "Handbook of Chemical Vapor Deposition (CVD) Principles, Technology and Applications", Noyes Publications 1992, pp. 330-332.
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