Method of forming through-holes in printed wiring board substrat

Details Method of forming through-holes in printed wiring board substrat Method of forming through-holes in printed wiring board substrat

1995-06-23

1997-08-05

Dang, Thi

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 17, 216 83, 216 92, H05K 300

Patent

active

056538936

ABSTRACT:
Through-holes are formed in a printed circuit board substrate by chemical etching a metal foil clad circuit board having open positions in the metal foil where a hole is to be formed using N-methyl-2-pyrrolidone, a mixture of methylene chloride and HF, or a mixture of methylene chloride, HF and xylene.

REFERENCES:
patent: 4155775 (1979-05-01), Alpaugh et al.
patent: 4431478 (1984-02-01), Yamaoka et al.
patent: 4911796 (1990-03-01), Reed
patent: 4964948 (1990-10-01), Reed
patent: 5236772 (1993-08-01), Horikoshi et al.
patent: 5311660 (1994-05-01), Alpaugh et al.
patent: 5346597 (1994-09-01), Lee et al.
patent: 5352325 (1994-10-01), Kato

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