Method of forming three-dimensional circuitry

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29848, 156150, 156233, 174251, 174252, H05K 302

Patent

active

051971844

ABSTRACT:
A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a TEFLON pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.

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IBM Technical Disclosure Bulletin vol. 2 No. 4 Dec., 1959 pp. 7-8 by Klippel.
IBM Technical Disclosure Bulletin vol. 24 No. 11A Apr. 1982, pp. 5508-5510 by D. G. Pittwood.

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