Method of forming thin film flexible interconnect for infrared d

Details Method of forming thin film flexible interconnect for infrared d Method of forming thin film flexible interconnect for infrared d

1992-09-25

1996-05-21

Fiorilla, Christopher A.

Plastic and nonmetallic article shaping or treating: processes

Forming electrical articles by shaping electroconductive...

264139, 264255, 264317, C04B 3500

Patent

active

055186742

ABSTRACT:
A method of forming an interconnect including the steps of providing a processing substrate, adhering a first electrically insulating layer to the substrate, forming an electrically conductive pattern on the first electrically insulating layer, forming a second electrically insulating layer adhered to the first electrically insulating layer with the electrically conductive pattern between the first and second electrically insulating layers, forming connections to the pattern and then removing the adhered first and second electrically insulating layers and the electrically conductive pattern from the substrate to provide a freestanding film.

REFERENCES:
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4709468 (1987-12-01), Wilson
patent: 4770897 (1988-09-01), Wu
patent: 5151388 (1992-09-01), Bakhit et al.

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