Method of forming thick-film wiring and method of producing...

Details Method of forming thick-film wiring and method of producing... Method of forming thick-film wiring and method of producing...

2006-05-23

2006-05-23

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C101S170000, C439S632000, C439S876000

Reexamination Certificate

active

07049176

ABSTRACT:
In a method of forming a thick-film wiring on a substrate, photosensitive-electroconductive paste is filled into a pattern groove formed on the surface of a light-transmitting intaglio plate. The pattern groove corresponds to a desired thick-film wiring pattern. The photosensitive-electroconductive paste filled in the pattern groove are irradiated with light-rays from the front and back sides of the intaglio plate to cause the paste to harden until the overall peripheral surface of the electroconductive paste has a predetermined hardness. The electroconductive paste hardened in the pattern grooves of the intaglio plate is transferred to an intermediate piece. Then, the electroconductive paste is transferred from the intermediate piece to a substrate. Thereafter, the electroconductive paste is fired, whereby a thick-film wiring is formed on the substrate.

REFERENCES:
patent: 5366760 (1994-11-01), Fujii et al.
patent: 5514503 (1996-05-01), Evans et al.
patent: 5853446 (1998-12-01), Carre et al.
patent: 6114404 (2000-09-01), Deeken et al.
patent: 6152033 (2000-11-01), Eid et al.
patent: 6732643 (2004-05-01), Kwon et al.
patent: 2001/0037738 (2001-11-01), Kinoshita
patent: 2002/0017864 (2002-02-01), Watanabe et al.
patent: 2002/0043523 (2002-04-01), Fujita et al.
patent: 2003/0091751 (2003-05-01), Tsuruta et al.
patent: 7-169635 (1995-07-01), None
patent: 11-154782 (1999-06-01), None
Korean Official Communication issued on Sep. 21, 2005 in the corresponding Korean Application No. 10-2003-0085026. (With full English translation).

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