Method of forming thick film pattern and material for forming th

Details Method of forming thick film pattern and material for forming th Method of forming thick film pattern and material for forming th

1996-08-08

1998-09-29

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Direct application of electrical or wave energy to work

Polymerizing, cross-linking, or curing

264402, 264610, 264642, 264317, C04B 3700

Patent

active

058142673

ABSTRACT:
A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.

REFERENCES:
patent: 3870776 (1975-03-01), McMahon
patent: 4119480 (1978-10-01), Nishi et al.
patent: 4336320 (1982-06-01), Cummings
patent: 4555285 (1985-11-01), Chance
patent: 4816200 (1989-03-01), Stecher
patent: 4994215 (1991-02-01), Wiech
patent: 5328816 (1994-07-01), Tamura
Word Patents Index, week 2278, AN=78,-39632A, Derwent Pub., Ltd, London, GB; & JP-A-53 045290, Abstract.
Microelectronics and Reliability, vol. 25, No. 1, 1985, pp. 61-63, Oxford, GB; A. Singh et al.: "Reverse photolithographic technique for thick film circuits" *Whole document *.
Patent Abstracts of Japan, vol. 008, No. 059 (E-232) 17 Mar. 1984 & JP-A-58 209 852 (Futaba Denshi Kogyo KK) 6 Dec. 1983.

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