Method of forming thermal conductive structure on printed circui

Details Method of forming thermal conductive structure on printed circui Method of forming thermal conductive structure on printed circui

1998-08-06

2000-03-07

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, H05K 334

Patent

active

060323558

ABSTRACT:
A method of manufacturing a thermal conductive structure on a printed circuit board comprises the steps of forming a thermal conductive layer having an embossed pattern on its surface, and then forming an adhesive glue layer over the thermal conductive layer. Next, a surface metallic layer is attached to the thermal conductive layer and the glue layer, wherein a portion of the surface metallic layer corresponding to the embossed portion of the heat spreader is in direct contact or almost direct contact with the thermal conductive layer. Furthermore, an additional external heat sink can be attached to thermal conductive structure for increasing the efficiency of heat dissipation.

REFERENCES:
patent: 4294009 (1981-10-01), Quintin et al.
patent: 4936010 (1990-06-01), Siuzdak
patent: 5471027 (1995-11-01), Call et al.
patent: 5592735 (1997-01-01), Ozawa et al.
patent: 5661089 (1997-08-01), Wilson
IBM Technical Disclosure Bulletin vol. 31 No. 8 Jan. 1989 pp. 135-138.
IBM Technical Disclosure Bulletin vol. 38 No. 8 Aug. 1995, pp. 547-548.

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