Method of forming temporary carrier structure and associated...

Details Method of forming temporary carrier structure and associated... Method of forming temporary carrier structure and associated...

2011-04-26

2011-04-26

Aftergut, Jeff H (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S154000, C156S247000, C156S248000, C156S257000, C156S268000, C156S345420

Reexamination Certificate

active

07931769

ABSTRACT:
A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the recesses and above a first surface of the carrier structure, securing a thin substrate above the first surface of the carrier structure using the dissolvable material to secure the thin substrate in place, performing at least one process operation on a second surface of the carrier structure to expose the dissolvable material in the recesses and contacting the exposed dissolvable material with a release agent so as to dissolve at least a portion of the dissolvable material.

REFERENCES:
patent: 3555659 (1971-01-01), Mracek
Derwent abstract of TW 444368, published by Derwent in 2002 (TW 444368 published Jul. 1, 2001).

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