Method of forming surface-smoothing layer for semiconductor...

Details Method of forming surface-smoothing layer for semiconductor... Method of forming surface-smoothing layer for semiconductor...

2005-01-25

2005-01-25

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Having magnetic or ferroelectric component

Reexamination Certificate

active

06846683

ABSTRACT:
A semiconductor device (118) and method of fabrication thereof, wherein a plurality of conductive lines (124) are formed over a workpiece, a surface-smoothing conductive material (140) is disposed over the conductive lines (124), and a magnetic material (132) disposed is over the surface-smoothing conductive material (140). The surface-smoothing conductive material (140) has a smaller grain structure than the underlying conductive lines (124). The surface-smoothing conductive material (140) is polished so that the surface-smoothing conductive material (140) has a texturally smoother surface than the surface of the conductive lines (124).

REFERENCES:
patent: 5407698 (1995-04-01), Emesh
patent: 5780323 (1998-07-01), Forouhi et al.
patent: 5940319 (1999-08-01), Durlam et al.
patent: 6500678 (2002-12-01), Aggarwal et al.
patent: 6528328 (2003-03-01), Aggarwal et al.
patent: 6534809 (2003-03-01), Moise et al.
patent: 6689622 (2004-02-01), Drewes
patent: 20020006674 (2002-01-01), Ma et al.
patent: 20020017701 (2002-02-01), Klersy et al.
patent: 20020096775 (2002-07-01), Ning
patent: 20020098705 (2002-07-01), Low
patent: 20020160541 (2002-10-01), Durcan et al.
patent: 0490608 (1992-06-01), None
patent: WO 0031809 (1998-11-01), None
patent: WO 0241367 (2002-05-01), None

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