Method of forming support structures for semiconductor devices

Details Method of forming support structures for semiconductor devices Method of forming support structures for semiconductor devices

2009-10-02

2010-12-28

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

With electrical circuit layout

C438S612000, C257S779000, C257SE21579

Reexamination Certificate

active

07858448

ABSTRACT:
Support structures for semiconductor devices and methods of manufacturing thereof are disclosed. In some embodiments, the support structures include a plurality of support members that is formed in a substantially annular shape beneath a wire bond region. The central region inside the substantially annular shape of the plurality of support members may be used to route functional conductive lines for making electrical contact to active areas of the semiconductor device. Dummy support structures may optionally be formed between the functional conductive lines. The support structures may be formed in one or more conductive line layers and semiconductive material layers of a semiconductor device. In other embodiments, support members are not formed in an annular shape, and are formed in insulating layers that do not comprise low dielectric constant (k) materials.

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