Method of forming super-paramagnetic cladding material on...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Magnetic field

Reexamination Certificate

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C438S003000

Reexamination Certificate

active

11179251

ABSTRACT:
A super-paramagnetic cladding layer formed on from 1 to 3 sides of a conductive line in a magnetic device is disclosed. The cladding layer is made of “x” ML/SL stacks in which x is between 5 and 50, SL is an amorphous AlOxseed layer, and ML is a composite with a soft magnetic layer comprised of discontinuous particles less than 2 nm in size on the seed layer and a capping layer of Ru, Ta, or Cu on the soft magnetic layer. Fringing fields and hysteresis effects from continuous ferromagnetic cladding layers associated with switching the magnetic state of an adjacent MTJ are totally eliminated because of the super-paramagnetic character of the soft magnetic layer at room temperature. The soft magnetic layer has near zero magnetostriction, very high susceptibility, and may be made of Ni˜80Fe˜20, Ni˜30Fe˜70, Co˜90Fe˜10, or CoNiFe.

REFERENCES:
patent: 6525957 (2003-02-01), Goronkin et al.
patent: 6720597 (2004-04-01), Janesky et al.
patent: 6730395 (2004-05-01), Covington
patent: 6844202 (2005-01-01), Prinz et al.
patent: 2003/0224103 (2003-12-01), Akinaga et al.
patent: 2005/0026308 (2005-02-01), Ingvarsson et al.
patent: 2005/0078511 (2005-04-01), Parkin
patent: 2006/0186495 (2006-08-01), Rizzo et al.
“A Low Power 1Mbit MRAM based on 1T1MTJ Bit Cell Integrated with Copper Connects”, Naji et al., VLSI Conf. (2002) pp. 1-22.

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