Method of forming substrate terminal areas for bonded leads

Details Method of forming substrate terminal areas for bonded leads Method of forming substrate terminal areas for bonded leads

1977-02-23

1978-05-30

DiPalma, Victor A.

Metal working

Method of mechanical manufacture

Electrical device making

29591, 29621, 29625, 174 685, 228179, H01R 4302, H05K 104

Patent

active

040915298

ABSTRACT:
A plurality of separate metallized regions on a substrate form a bondsite for a single lead to be bonded to the substrate. The metallized regions are electrically interconnected at a point removed from the bondsite. Such multiple metallized regions offer redundant bonds for each such lead to improve the mechanical strength and to improve the reliability of the bond between the lead and the substrate.

REFERENCES:
patent: 3256465 (1966-06-01), Weissenstern et al.
patent: 3284176 (1966-11-01), Reed et al.
patent: 3567844 (1971-03-01), Kremar
patent: 3698073 (1972-10-01), Helda
patent: 3705047 (1972-12-01), Marriott
patent: 3841905 (1974-10-01), Dixon
patent: 4004726 (1977-01-01), Ellington

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