Method of forming stackable package

Details Method of forming stackable package Method of forming stackable package

2008-06-10

2008-06-10

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000, C438S108000, C438S110000, C438S508000, C254S391000, C254S391000

Reexamination Certificate

active

07384819

ABSTRACT:
A method of forming a semiconductor package (50and52) includes providing a substrate (14) having a die pad and bond pads on a first surface (20) and conductive pads (66, 68and74) on a second surface (22). An integrated circuit (IC) die (38) is attached to the die pad and the first surface (20) of the substrate (14) is attached to a lead frame (26). The substrate (14) is electrically connected to the lead frame (26), and the IC die (38) is electrically connected to the substrate (14) and the lead frame (26). The IC die (14), the electrical connections (40, 42and44), a portion of the substrate (14) and a portion of the lead frame (26) are encapsulated with a mold compound (46), forming a stackable package (48). The conductive pads (66, 68and74) on the second surface (22) of the substrate (14) are not encapsulated by the mold compound (46).

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