Method of forming solder resist pattern

Details Method of forming solder resist pattern Method of forming solder resist pattern

2003-10-02

2008-10-14

Ahmed, Shamim (Department: 1792)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S065000, C219S121600, C219S121680, C029S831000, C029S852000, C174S254000, C174S260000

Reexamination Certificate

active

07435352

ABSTRACT:
A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printed circuit boards, which are fabricated either by the buildup process or the parallel process. Lower manufacturing costs and improved accuracy of the solder resist pattern can be achieved due to the simplified process.

REFERENCES:
patent: 4943516 (1990-07-01), Kamayachi et al.
patent: 5324535 (1994-06-01), Ishido
patent: 5447619 (1995-09-01), Wolski et al.
patent: 5626774 (1997-05-01), Paulus
patent: 5837355 (1998-11-01), Hayai
patent: 5879568 (1999-03-01), Urasaki et al.
patent: 6221972 (2001-04-01), Nakamura et al.
patent: 2002/0007964 (2002-01-01), Mori et al.
patent: 2002/0026980 (2002-03-01), Nakatani et al.
patent: 2002/0052062 (2002-05-01), Sakamoto et al.
patent: 2004/0033746 (2004-02-01), Kurumatani et al.

Affiliated with

Also associated with

Rating

Method of forming solder resist pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming solder resist pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming solder resist pattern will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4001221