Method of forming solder-holding clips for applying solder to co

Details Method of forming solder-holding clips for applying solder to co Method of forming solder-holding clips for applying solder to co

1996-10-07

1999-03-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29874, 439 83, 439876, H01R 900

Patent

active

058755462

ABSTRACT:
An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

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