Method of forming solder bumps and method of forming preformed s

Details Method of forming solder bumps and method of forming preformed s Method of forming solder bumps and method of forming preformed s

1998-05-15

2000-08-29

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

22818022, 228254, 2282481, 29840, 437183, B23K 3102, H05K 332

Patent

active

061095079

ABSTRACT:
A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.

REFERENCES:
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patent: 5346118 (1994-09-01), Degani et al.
patent: 5641113 (1997-06-01), Somaki et al.
patent: 5672260 (1997-09-01), Carey et al.
patent: 5672542 (1997-09-01), Schweibert et al.
patent: 5825629 (1998-10-01), Hoebener et al.
patent: 5912505 (1999-06-01), Itoh et al.

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