Method of forming silicon chicklet pedestal

Details Method of forming silicon chicklet pedestal Method of forming silicon chicklet pedestal

2011-08-02

2011-08-02

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S840000, C174S260000

Reexamination Certificate

active

07987591

ABSTRACT:
A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

REFERENCES:
patent: 6031382 (2000-02-01), Nakaizumi
patent: 6188231 (2001-02-01), Palagonia
patent: 6507497 (2003-01-01), Mashino
patent: 6819127 (2004-11-01), Hembree
patent: 6888223 (2005-05-01), Brouillette et al.
patent: 6956386 (2005-10-01), Kim et al.
patent: 6967494 (2005-11-01), Kline
patent: 7022553 (2006-04-01), Ahn et al.
patent: 7025891 (2006-04-01), Codding et al.
patent: 2005/0253606 (2005-11-01), Kim et al.
patent: 2008/0017407 (2008-01-01), Kawano
patent: 1847834 (2006-02-01), None
patent: 2006222309 (2006-08-01), None
Deng Chun et al.; “A MEMS Based Interposer for Nano-Wafer Level Packaging Test”; IEEE Xplore; http://ieeexplore.ieee.org/xpl/absprintf.jsp?arnumber-1271555&page=FREE; Sep. 2, 2008.
L Criscuolo; “Using Silicon Contacts to Test and Burn-In Flash Memory, Microprocessors, and FPGAs”; IEEE Xplore; http://ieeexplore.ieee.org/xpls/absprintf.jsp?arnumber=670813; Sep. 2, 2008.

Affiliated with

Also associated with

Rating

Method of forming silicon chicklet pedestal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming silicon chicklet pedestal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming silicon chicklet pedestal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2657704