Method of forming semiconductor device with a buried junction

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 59, 437149, H01L 218228

Patent

active

056058519

ABSTRACT:
A method is disclosed for forming a first region with conductivity of a first type and second, buried region with conductivity of a second type which forms a junction with the first region. By first and second doping steps, impurities of a first and a second type are successively introduced into a silicon chip. A high-temperature treatment causes the impurities thus introduced to diffuse and form said first and second regions. In order to provide a buried region whose concentration and/or depth are little dependent on process parameters, the second doping step comprises a first sub-step of low dosage and high energy implantation, and a second sub-step of low dosage and high energy implantation. The dosages and energies are such that they will not compensate or reverse the type of conductivity of the first region, and such that the concentration in the second region will be substantially due to the second implantation step only.

REFERENCES:
patent: 4283236 (1981-08-01), Sirsi
patent: 4536945 (1985-08-01), Gray et al.
patent: 5028557 (1991-07-01), Tsai et al.
patent: 5208171 (1993-05-01), Ohmi
patent: 5290714 (1994-03-01), Onozawa

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming semiconductor device with a buried junction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming semiconductor device with a buried junction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming semiconductor device with a buried junction will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1973798

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.