Method of forming semiconducting materials and barriers using a

Fishing – trapping – and vermin destroying

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427569, 118719, H01L 2100, H01L 2102, H01L 2120

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054707846

ABSTRACT:
In a gaseous glow-discharge process for coating a substrate with semiconductor material, a variable electric field in the region of the substrate and the pressure of the gaseous material are controlled to produce a uniform coating having useful semiconducting properties. Electrodes having concave and cylindrical configurations are used to produce a spacially varying electric field. Twin electrodes are used to enable the use of an AC power supply and collect a substantial part of the coating on the substrate. Solid semiconductor material is evaporated and sputtered into the glow discharge to control the discharge and improve the coating. Schottky barrier and solar cell structures are fabricated from the semiconductor coating. Activated nitrogen species is used to increase the barrier height of Schottky barriers.

REFERENCES:
patent: 4226897 (1980-10-01), Coleman
patent: 4328258 (1982-05-01), Coleman
patent: 4438723 (1984-03-01), Cannella et al.
patent: 4492716 (1985-01-01), Yamazaki
patent: 4615298 (1986-10-01), Yamazaki
patent: 4636401 (1987-01-01), Yamazaki et al.
patent: 4664951 (1987-05-01), Doehler
patent: 4798166 (1989-01-01), Hirooka et al.
patent: 4800174 (1989-01-01), Ishihara et al.
patent: 4803947 (1989-02-01), Ueki et al.
patent: 4920917 (1990-05-01), Nakatani et al.
patent: 4951602 (1990-08-01), Kanai
patent: 5049523 (1991-09-01), Coleman
patent: 5187115 (1993-02-01), Coleman
patent: 5240505 (1993-08-01), Iwasaki et al.
patent: 5288379 (1994-02-01), Namiki et al.
patent: 5324360 (1994-06-01), Kozuka
Poley, In-line Buffer for continuous vacuum coating Machine, IBM Tech. Discl. Bull., vol. 18, No. 5, Oct. 1975, pp. 1504-1505.

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