Method of forming resistance film

Coating processes – Electrical product produced – Resistor for current control

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S189000

Reexamination Certificate

active

08039043

ABSTRACT:
The invention provides a method of forming a resistance film with even thickness and at high speed even in a substrate having micro depressions and projections in its surface. A fine particle dispersion solution is prepared by adding a solution which decreases the absolute value of a ξ potential at the fine particles and a solution which decreases dispersion stability of the fine particles into a solution in which metal oxide fine particles are stably dispersed, a substrate having an insulating surface is immersed in the fine particle dispersion solution to deposit a fine particle aggregation film, and then a resistance film is obtained by performing heat treatment.

REFERENCES:
patent: 3672931 (1972-06-01), Grosso et al.
patent: 5409544 (1995-04-01), Ota et al.
patent: 6048910 (2000-04-01), Furuya et al.
patent: 6485345 (2002-11-01), Fushimi
patent: 6506675 (2003-01-01), Oomiya et al.
patent: 6600263 (2003-07-01), Ito
patent: 6847161 (2005-01-01), Ito
patent: 2002/0195925 (2002-12-01), Fushimi
patent: 2003/0141803 (2003-07-01), Fushimi
patent: 2004/0041507 (2004-03-01), Ito
patent: 044878 (1982-02-01), None
patent: 44878 (1980-07-01), None
patent: 03-74845 (1991-03-01), None
patent: 05-265252 (1993-10-01), None
patent: 06-116424 (1994-04-01), None
patent: 09-22885 (1997-01-01), None
patent: 10-279886 (1998-10-01), None
patent: 11-080985 (1999-03-01), None
patent: 2000-311605 (2000-11-01), None
patent: 2000-311609 (2000-11-01), None
patent: 2003-022710 (2003-01-01), None
patent: 2003-098558 (2003-04-01), None
patent: 2003-191605 (2003-07-01), None
patent: 2003-223858 (2003-08-01), None
patent: 2004-344854 (2004-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming resistance film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming resistance film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming resistance film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4265417

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.