Method of forming resist micropattern

Details Method of forming resist micropattern Method of forming resist micropattern

1985-04-09

1987-01-06

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

430296, 430312, 430314, 430317, 430942, 430967, G03C 500

Patent

active

046346457

ABSTRACT:
A resist pattern is formed on a substrate by forming a resist on a substrate and radiating an energy beam carrying predetermined pattern information onto the resist, thereby forming a recessed pattern in a surface portion of the resist so as not to extend through the resist. A flat mask layer is formed on the resist including the recessed pattern. The mask layer is uniformly etched along a direction of thickness thereof until at least a surface of the resist is exposed to allow the mask layer to remain on at least a bottom of the recessed pattern, thereby forming a mask pattern comprising the remaining residual mask layer. Finally, the resist is etched by using the mask pattern as an etching mask.

REFERENCES:
patent: 4215935 (1980-08-01), Loebach
patent: 4457820 (1984-07-01), Bergeron et al.
patent: 4474642 (1984-10-01), Nakane et al.
patent: 4479848 (1984-10-01), Otsubo et al.
patent: 4528438 (1985-07-01), Poulsen et al.
patent: 4546066 (1985-10-01), Field et al.

Affiliated with

Also associated with

Rating

Method of forming resist micropattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming resist micropattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming resist micropattern will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-683771