Method of forming reliable copper interconnects with improved ho

Details Method of forming reliable copper interconnects with improved ho Method of forming reliable copper interconnects with improved ho

1999-01-05

2000-08-15

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205170, 205184, 205222, 205291, 205915, C25D 556, C25D 510, C25D 552, C25D 338, C23C 2802

Patent

active

061030864

ABSTRACT:
The reliability of Cu and Cu alloy interconnects is significantly enhanced by controlling the temperature of the electroplating solution during via opening filling to substantially prevent occlusion of the opening. Embodiments of the present invention include electroplating Cu or a Cu alloy from an electroplating solution at a temperature of about 20.degree. C. or less.

REFERENCES:
patent: 5972192 (1999-10-01), Dubin et al.

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