Method of forming raised metallic contacts on electrical circuit

Details Method of forming raised metallic contacts on electrical circuit Method of forming raised metallic contacts on electrical circuit

1996-05-29

1998-05-05

Niebling, John

Fishing, trapping, and vermin destroying

437203, 1566571, H01L 2144

Patent

active

057473587

ABSTRACT:
A method is provided for forming at least one raised metallic contact on an electrical circuit. Generally, this method includes the following steps: providing a composite base substrate which is defined by at least a first conductive layer, a dielectric material and a second conductive layer; removing a portion of the first conductive layer to expose the dielectric material; removing the exposed portion of the dielectric material to the second conductive layer, thereby forming a depression; depositing at least one layer of conductive material on at least side wall portions of the depression; removing the second conductive layer; and completely removing the dielectric material to said first conductive layer thereby forming a raised metallic contact which extends perpendicularly away from the first conductive layer.

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