Method of forming printed circuits having multiple conductor thi

Details Method of forming printed circuits having multiple conductor thi Method of forming printed circuits having multiple conductor thi

1997-09-10

1999-11-16

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

216 14, 216 33, B44C 122

Patent

active

059851619

ABSTRACT:
A method of forming a conductive network, having relatively flexible electrical conductor areas integral with relatively rigid electrically conductor areas including (a) providing a relatively rigid laminate having a dielectric lamina supporting, at least in part, a first electrically conductive lamina which is in electrically conductive intimate contact with a second electrically conductive lamina by way of an electrically conductive barrier layer, the first and second conductive laminae being of a material etchable by an etchant which is not an etchant for the barrier layer; (b) selectively etching desired portions of the aid second electrically conductive lamina to the barrier layer in at least the relatively flexible areas using the etchant; and (c) selectively etching desired exposed metallic portions of the laminate down to the dielectric lamina to form the conductive network using an etchant, the etchant chosen to etch both the conductive lamina and the barrier layer.

REFERENCES:
patent: 5274195 (1993-12-01), Murphy et al.
patent: 5378306 (1995-01-01), Cibulsky et al.
patent: 5505321 (1996-04-01), Caron et al.

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