Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-08
2008-04-08
Batson, Victor (Department: 4155)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S846000, C029S852000, C029S847000, C174S262000, C235S492000, C343S895000, C343S866000, C343S873000
Reexamination Certificate
active
11224191
ABSTRACT:
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
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Fallon Kenneth
Jimarez Miguel A.
Keesler Ross W.
Lauffer John M.
Magnuson Roy H.
Angwin David P
Batson Victor
Daugherty Patrick J.
Driggs, Hogg, Daugherty & Del Zoppo Co., LPA
International Business Machines - Corporation
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