Method of forming printed circuit

Details Method of forming printed circuit Method of forming printed circuit

1980-12-03

1981-12-15

Kendall, Ralph S.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427306, 430 15, C23C 302, H01B 514

Patent

active

043059759

ABSTRACT:
A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer to provide the non-masked region as a circuit-forming region. Further, the circuit-forming region is treated with a solution of an oxidizing agent and, then, subjected to an activation treatment. Finally, the mask is removed and a desired conductive layer pattern is formed on the activated surface region by means of electroless plating.

REFERENCES:
patent: 4151313 (1979-04-01), Wajima et al.

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