Method of forming porous silicon

Etching a substrate: processes – Forming or treating optical article

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216 99, H01L 2100

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054276489

ABSTRACT:
Porous silicon is formed by patterning a single crystal silicon substrate prior to electrochemically etching the same. The process is a controlled method of fabricating silicon microstructures which exhibit luminescence and are useful in optoelectronic devices, such as light emitting diodes. The porous silicon produced has a high degree of uniformity and repeatability.

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