Method of forming plugs in vias of a circuit board by utilizing

Details Method of forming plugs in vias of a circuit board by utilizing Method of forming plugs in vias of a circuit board by utilizing

1996-06-26

1998-06-09

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29 33M, 29884, 29885, 174257, 174265, 427 97, H05K 340

Patent

active

057618038

ABSTRACT:
A conductive plug is formed in drilled-through vias of a printed circuit board of a polymer ink composition by a method of flooding the vias of a printed circuit board having parchment paper attached to an underside while the printed circuit board is on a vacuum table to form a first layer of the conductive plug within the vias. A second layer of the conductive plug within the via is formed by placing a stencil over the circuit board and flooding the holes of the stencil in order to form a second layer of the conductive plug within the vias of the printed circuit board.

REFERENCES:
patent: 2848359 (1958-08-01), Talmey
patent: 4107837 (1978-08-01), Chang
patent: 4323593 (1982-04-01), Tsunashima
patent: 4908940 (1990-03-01), Amano et al.
patent: 4925723 (1990-05-01), Bujatti et al.
patent: 4964948 (1990-10-01), Reed
patent: 5274916 (1994-01-01), Kawabata et al.
patent: 5456004 (1995-10-01), Swany

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