Cutting – Other than completely through work thickness or through work... – Scoring
Patent
1991-02-27
1994-01-04
Yost, Frank T.
Cutting
Other than completely through work thickness or through work...
Scoring
83 30, 83427, 83428, 83575, B26D 308, B26F 102
Patent
active
052750779
ABSTRACT:
A method of forming a perforated cut line using a cutting plotter capable of accurately and rapidly forming a sheet with a perforated cut line along a cut line which is predetermined on a sheet and along which the sheet is to be cut. A cutter pressure at which a cutter is pressed onto the sheet is repeatedly reduced for a micro period of time at predetermined time intervals to form the sheet with a perforated cut line consisting of perforations and unperforated parts defined between the perforations in an intermittent manner.
REFERENCES:
patent: 3973453 (1976-08-01), Tameo
patent: 4467525 (1984-08-01), Logan et al.
patent: 4524894 (1985-06-01), Leblond
patent: 4732069 (1988-03-01), Wood et al.
patent: 4920495 (1990-04-01), Pilkington
patent: 5136910 (1992-08-01), Kuhn et al.
Mimaki Engineering Co., Ltd.
Peterson Kenneth E.
Yost Frank T.
LandOfFree
Method of forming perforated cut line by cutting plotter does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming perforated cut line by cutting plotter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming perforated cut line by cutting plotter will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-299484