Method of forming patterns in organic coatings films and layers

Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427259, 427261, 427269, 427270, 427272, 427273, 427282, 427287, 427322, 427327, 427335, 4274071, 427409, 4274121, 427555, 427556, 427557, 427560, C08J 704

Patent

active

057630160

ABSTRACT:
Water-free, gaseous sulfur trioxide is used as an agent to form patterns in organic coatings, films, and layers, including photoresists, by etching areas exposed to the agent through an overlying mask or by developing a latent image of the desired pattern using the agent as a dry-developer.

REFERENCES:
patent: 4179071 (1979-12-01), Kozacka
patent: 4669544 (1987-06-01), Nimerick
patent: 4778536 (1988-10-01), Grebinski
patent: 4915912 (1990-04-01), Walles et al.
patent: 5030399 (1991-07-01), Walles et al.
patent: 5037506 (1991-08-01), Gupta et al.
patent: 5158100 (1992-10-01), Tanaka et al.
Stanley Wolf and Richard N. Tauber, "Silicon Processing For The VLSI Era", Process Technology, vol. 1 (1986), pp. 564-564; (no month avail.).
"Choose the Right Process to Strip Your Photoresist", Semiconductor International, Feb. 1990, pp. 83-87.
"New Concerns in Dry Oxygen Ashing", Semiconductor International, Mar. 1996, p. 44.
"What's Driving Resist Dry Stripping?", Semiconductor International, Nov. 1994, pp. 61-64.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming patterns in organic coatings films and layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming patterns in organic coatings films and layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming patterns in organic coatings films and layers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2196422

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.