Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Patent
1996-12-19
1998-06-09
Pianalto, Bernard
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
427259, 427261, 427269, 427270, 427272, 427273, 427282, 427287, 427322, 427327, 427335, 4274071, 427409, 4274121, 427555, 427556, 427557, 427560, C08J 704
Patent
active
057630160
ABSTRACT:
Water-free, gaseous sulfur trioxide is used as an agent to form patterns in organic coatings, films, and layers, including photoresists, by etching areas exposed to the agent through an overlying mask or by developing a latent image of the desired pattern using the agent as a dry-developer.
REFERENCES:
patent: 4179071 (1979-12-01), Kozacka
patent: 4669544 (1987-06-01), Nimerick
patent: 4778536 (1988-10-01), Grebinski
patent: 4915912 (1990-04-01), Walles et al.
patent: 5030399 (1991-07-01), Walles et al.
patent: 5037506 (1991-08-01), Gupta et al.
patent: 5158100 (1992-10-01), Tanaka et al.
Stanley Wolf and Richard N. Tauber, "Silicon Processing For The VLSI Era", Process Technology, vol. 1 (1986), pp. 564-564; (no month avail.).
"Choose the Right Process to Strip Your Photoresist", Semiconductor International, Feb. 1990, pp. 83-87.
"New Concerns in Dry Oxygen Ashing", Semiconductor International, Mar. 1996, p. 44.
"What's Driving Resist Dry Stripping?", Semiconductor International, Nov. 1994, pp. 61-64.
Levenson Eric O.
Waleh Ahmad
Anon, Incorporated
Pianalto Bernard
LandOfFree
Method of forming patterns in organic coatings films and layers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming patterns in organic coatings films and layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming patterns in organic coatings films and layers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2196422