Method of forming passivation film

Metal working – Method of mechanical manufacture – Assembling or joining

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Details

29590, 156643, 156656, 156657, 156667, 156668, 148175, 148187, 204 38A, 204192R, 204192D, H01L 21203

Patent

active

040670996

ABSTRACT:
A method of forming a passivation film, wherein after circuit elements have been formed in the semiconductor substrate, a thin conductive film is formed on the entire surface of the substrate and then an insulating film is formed through electric discharge on the surface of the thin conductive film while the thin conductive film is kept at a constant potential.

REFERENCES:
patent: 3423303 (1969-01-01), Davidse et al.

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