Method of forming passivated polycrystalline semiconductors

Metal treatment – Compositions – Heat treating

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136258, 357 59, 427 39, 427 74, 427 86, H01L 21223, H01L 21322

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046133828

ABSTRACT:
A semiconductor device includes a polycrystalline semiconductor film body having at least one element selected from a group consisting of hydrogen, fluorine, chlorine, bromine, iodine, lithium, sodium, potassium, rubidium, and cesium included mainly around grain boundaries of the polycrystalline semiconductor film. The simultaneous inclusion of one of the halogen elements and one of the monovalent metal elements of the group described above is more effective to quench charges of the elements included. The content of the elements included is up to 40% by atomic ratio. As a result, the electronic characteristic of the polycrystalline semiconductor film are substantially improved.

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