Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2005-09-19
2011-10-25
Alanko, Anita (Department: 1713)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S083000, C216S087000, C216S095000, C216S096000, C216S099000
Reexamination Certificate
active
08043517
ABSTRACT:
A method of forming an opening through a substrate includes defining an area on a first surface of the substrate where the opening is to be formed, the area having a center region flanked by edge regions. A top layer having a substantially closed space located over the area is formed on the first surface. Structure for promoting etching of the center region is provided, and the first surface of the substrate is etched in the area. In one embodiment, the method can fabricate an inkjet printhead having a substrate having an ink feed hole formed therethrough and an orifice plate formed thereon. A plurality of particle tolerance elements located over a center region of the ink feed hole promoted etching during the fabrication of the printhead.
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Donaldson Jeremy Harlan
Gu Jianhui
Rivas Rio
Rojas Bernard A
Alanko Anita
Hewlett--Packard Development Company, L.P.
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