Method of forming one or more base structures on an LTCC...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S840000, C029S851000, C156S089120, C174S259000, C361S830000

Reexamination Certificate

active

07127809

ABSTRACT:
An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

REFERENCES:
patent: 5006182 (1991-04-01), Gantzhorn et al.
patent: 5847326 (1998-12-01), Kawakami et al.
patent: 6041496 (2000-03-01), Haq et al.
patent: 6271579 (2001-08-01), Going et al.
patent: 6384473 (2002-05-01), Peterson et al.

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