Fishing – trapping – and vermin destroying
Patent
1993-10-29
1996-01-23
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437194, 437195, H01L 21285, H01L 213065
Patent
active
054864925
ABSTRACT:
A method of forming a via structure having good characteristics in a semiconductor device having a multilayered wiring structure includes forming a thin film including a high melting point metal or a high melting point metal compound on at least the side wall of a via hole before a via plug including Al or an Al alloy is formed.
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Ohta Tomohiro
Takeyasu Nobuyuki
Yamamoto Hiroshi
Chaudhuri Olik
Everhart C.
Kawasaki Steel Corporation
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