Method of forming multilayer interconnection structure

Details Method of forming multilayer interconnection structure Method of forming multilayer interconnection structure

1993-03-26

1994-05-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437192, 437193, 437195, H01L 2144

Patent

active

053127730

ABSTRACT:
The disclosure relates to a method of forming a multilayer interconnection structure. The structure is a laminated body having a first conductive layer, a first insulating layer, a second conductive layer and a second insulating layer in an ascending order. In the method, firstly, a through-hole is formed on the laminated body so as to expose a surface of the first conductive layer and two opposed surfaces of the second conductive layer. Then, the two opposed surfaces of the second conductive layer is masked with a masking film, so as not to deposit thereon a conductive material which has a strong and selective adhesion on the first and second conductive layers. Then, the conductive material is deposited on the surface of the first conductive layer by a chemical vapor deposition method so as to fill a lower portion of the through-hole with the conductive material. Then, the masking film is removed so as to expose the two opposed surfaces of the second conductive layer. Then, the conductive material is deposited on the two opposed surfaces of the second conductive layer by the chemical vapor deposition method so as to fill an upper portion of the through-hole with the conductive material, such that the through-hole is filled with the conductive material and that the first and second conductive layers are interconnected with each other.

REFERENCES:
patent: 4963511 (1990-10-01), Smith
patent: 4977105 (1990-12-01), Okamoto et al.
patent: 5006484 (1991-04-01), Harada
patent: 5143861 (1992-09-01), Turner

Affiliated with

Also associated with

Rating

Method of forming multilayer interconnection structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming multilayer interconnection structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming multilayer interconnection structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-876515