Method of forming microcoil structure for integrated circuits

Stock material or miscellaneous articles – Religious artifact

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438298, H01L 2100, H01L 21336

Patent

active

058638067

ABSTRACT:
A microcoil structure for use in an integrated circuit to produce magnetic flux for specific applications or to serve as an inductor is provided. Further, a method for forming the foregoing microcoil structure in a semiconductor wafer is provided. The microcoil structure includes a plurality of diffusion regions having two ends formed with ohmic contact regions. A field-oxide region and an overlaying insulating layer are formed over the diffusion regions. The field oxide region and the insulating layer together serve as a core member for the microcoil structure Further, a plurality of conductive layers are electrically connected between the diffusion regions in such a manner as to form a coil-like structure which winds around the core member to form the desired microcoil structure. When current is input to this microcoil structure, a magnetic flux is produced. The magnitude and polarity of the magnetic flux can be controlled by varying the magnitude and direction of the input current.

REFERENCES:
patent: 5686327 (1997-11-01), Park
patent: 5686347 (1997-11-01), Yang
patent: 5747372 (1998-05-01), Lim

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming microcoil structure for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming microcoil structure for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming microcoil structure for integrated circuits will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1449960

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.