Method of forming metal wiring and method of manufacturing...

Details Method of forming metal wiring and method of manufacturing... Method of forming metal wiring and method of manufacturing...

2007-03-14

2010-06-01

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

C438S587000, C438S674000, C438S654000, C257SE21586

Reexamination Certificate

active

07727869

ABSTRACT:
A method of forming a metal wiring includes: forming a foundation layer on a substrate; applying a solution including fine metal particles and a dispersion stabilizer on the foundation layer; and heating the applied solution to form into a conductive layer, wherein after the applying of the solution, the conductive layer is formed by starting the heating of the applied solution within a detained time.

REFERENCES:
patent: 5930607 (1999-07-01), Satou
patent: 6624071 (2003-09-01), Seki
patent: 6810814 (2004-11-01), Hasei
patent: 2005/0276912 (2005-12-01), Yamamoto et al.
patent: 11-274671 (1999-10-01), None
patent: 2000-216330 (2000-08-01), None
patent: 3261699 (2001-12-01), None
patent: 2003-317610 (2003-11-01), None

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