Method of forming metal plate pattern and circuit board

Details Method of forming metal plate pattern and circuit board Method of forming metal plate pattern and circuit board

2006-08-18

2008-11-25

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S874000, C438S612000, C438S616000

Reexamination Certificate

active

07454832

ABSTRACT:
A method of forming a high aspect ratio metal plate pattern or circuit board by multi-stage etching with a metal mask is disclosed. A resist (12) is coated on one or two surfaces of a copper plate (10) and patterned into a resist pattern. A tin plating layer (14) is formed using this resist pattern, and with this tin plating layer as a mask, the copper plate is half etched. By coating, exposing and developing the positive resist (18), the positive resist under the tin plating layer is protected. With the tin plating layer and the protective resist layer as a mask, the half etching is executed again. This process is repeated until the resist and the tin plating layer used as a masking are finally removed to produce a metal pattern (20).

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